Product Features
Up to 1.25Gb/s bi-directional data links
Hot-pluggable SFP footprint
Case temperature range(0℃ to +70℃ )
Fully metallic enclosure for low EMI
Low power dissipation (1.05 Wtypical)
Compact RJ-45 connector assembly
Access to physical layer IC via 2-wireserial bus
1000BASE-T operation in host
systems with SERDES interface
10/100/1000Mbps compliant in hostsystems with SGMII interface