QC-SP-GE-TG
Product Features
Up to 1.25Gb/s bi-directional data links
Hot-pluggable SFP footprint
Case temperature range(0℃ to +70℃ )
Fully metallic enclosure for low EMI
Low power dissipation (1.05 Wtypical)
Compact RJ-45 connector assembly
Access to physical layer IC via 2-wireserial bus
10/100/1000Mbps compliant in hostsystems with SGMII interface
Up to 1.25Gb/s bi-directional data links
Hot-pluggable SFP footprint
Case temperature range(0℃ to +70℃ )
Fully metallic enclosure for low EMI
Low power dissipation (1.05 Wtypical)
Compact RJ-45 connector assembly
Access to physical layer IC via 2-wireserial bus
10/100/1000Mbps compliant in hostsystems with SGMII interface
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QC-SP-GE-TG-千兆自适应
公司地址：深圳市龙岗区坂田高新技术工业园A栋（坂田贝尔路）
电 话：13392418722
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Email：3218832674@qq.com
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